on your site I read that the component is available in MSL3 packaging :
Available in MSL3 level packaging
The data sheet indicates that:
Mounting to Host PCBs The JTAG-SMT2-NC module has a moisture sensitivity level (MSL) of 6. Prior to reflow, the JTAG-SMT2-NC module must be dried by baking it at 125° C for 17 hours. Once this process has been completed, the module has a MSL of 3 and is suitable for reflow for up to 168 hours without additional drying.
Do I have to think that the components you made available with MSL3 are those with MSL6 with baking already done?
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megael
Good Evening,
on your site I read that the component is available in MSL3 packaging :
Available in MSL3 level packaging
The data sheet indicates that:
Mounting to Host PCBs The JTAG-SMT2-NC module has a moisture sensitivity level (MSL) of 6. Prior to reflow, the JTAG-SMT2-NC module must be dried by baking it at 125° C for 17 hours. Once this process has been completed, the module has a MSL of 3 and is suitable for reflow for up to 168 hours without additional drying.
Do I have to think that the components you made available with MSL3 are those with MSL6 with baking already done?
Or do they have constructive differences?
Thank you very much.
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