TireV

Hey @zygot, first of all, Thank you for this detailed answer! I'm aware of the thermal aspects in electronics in general, but the fact that FPGA-timing is temperature depending was useful! In addition to thermal issues, I'm interested in EMC, so that's why I was asking about the stack-up and common groundplate. A huge copper plate will likely cause much more Trouble under external Radiation than just single ground lines. On the other side it's a bigger heat sink for distributing thermal gradients equal. The amount of Connections (balls) is obvious, but unfortunately I didn't check for this in the datasheet... Thanks! So by now I'm on research but still grateful for any additional comments or Inputs (links, datasheets, ...)

Hello all together, I'm working on a CmodS6 board for my university course right now. It'd be helpful to now something about the layer design of the Board. I assume it's a multilayer PCB, so at least 1 layer between front and back side, but can anyone tell me something more about it? e.g. common ground plate yes/no? Hope these information are not somehow confidential or protected, then never mind my question :) Thanks for any input!